Since its founding in Japan’s ancient capital, Kyoto, in April 1979, TOWA Corporation has consistently developed proprietary technologies and created numerous de facto standards. Its primary operations are composed of development, manufacturing and sales of resin encapsulation systems for semiconductors and LED resin sealed devices, singulation systems and precision molds for manufacturing semiconductors, as well as the manufacture and sales of fine plastic molded products. TOWA maintains a leading share of the global market for its mainstay semiconductor resin encapsulation systems, which enjoy an excellent reputation with users.