PACK EXPO International: ETG Booth

PACK EXPO International: ETG Booth

Data: 03.11.2024 - 06.11.2024
Città, Paese: Chicago (IL), USA
Luogo: McCormick Place
Padiglione, Stand: Lakeside Upper, 8045
Tipo: Fiera
Indirizzo web: www.packexpointernational.com
Ulteriori informazioni:

ETG participates in the PACK EXPO International, the world’s most comprehensive packaging and processing event this year. Visit our EtherCAT experts at booth LU-8045 from November 3 - 6!