Modular Device Profile (MDP)
The Modular Device Profile (MDP) defines a modelling of structures within in a device. Mainly the object dictionary structure and corresponding behaviour of the entries is defined by the MDP. The intention is to provide an easy way for master and configuration tools to handle the devices.
A modular structure can be used for all kind of devices that supports physical or logical modules. This can be for example:
- Gateways from Fieldbusses to EtherCAT
- Multi Axis servo drives (physical modules) with each axis having independent operation modes (logic modules)
- Extendable bus coupler with an internal backbone (e.g. sliced I/Os)
The MDP specification is divided in the following subparts:
- ETG.5001.1: General MDP Device Model
- ETG.5001.4: MDP Safety Module Specification
- ETG.5001.x: MDP Module Specification (x represents the Module Profile number)
Descripción | Language | Tipo | Fecha | Tamaño | Ver. | Estado | |
---|---|---|---|---|---|---|---|
ETG.5001.1 General MDP Device Model Specification | EN | Oct 19, 2021 | 0,58 MB | 0.10.0 | Draft for Review | ||
ETG.5001.2.800 Vision Sensor Profile | EN | ZIP | Oct 09, 2013 | 0,55 MB | 0.5.2 | Draft for Review | |
ETG.5001.3 MDP Fieldbus Gateway Profile Specification | EN | Aug 05, 2016 | 1,50 MB | 0.1.2 | Draft for Review | ||
ETG.5001.4 MDP Safety Module Specification | EN | Jul 15, 2020 | 0,47 MB | 1.1.0 | Release | ||
ETG.5001.6220 MDP IO-Link Master | EN | May 02, 2017 | 0,44 MB | 1.0.5 | Release | ||
TF-4401 IO Link Profile Test File Set | EN | ZIP | Jul 12, 2017 | 0,06 MB | 1.1.0 | Release | |
ETG.5001 Comment Form | EN | DOC | Feb 17, 2016 | 0,03 MB |
You may not copy, distribute or “mirror” the files or printed versions of the documents, or any part of it, without permission in writing from the ETG (EtherCAT Technology Group).